Title:
METHOD OF MANUFACTURING RIGID/FLEXIBLE MULTILAYERED WIRING SUBSTRATE, AND INTEGRATED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/062146
Kind Code:
A1
Abstract:
Disclosed is a method of manufacturing a rigid/flexible multilayered wiring substrates so as to cover a region of a first thermoplastic sheet in a primary surface that is to be formed into a flexible portion, the method comprising the steps of forming a release layer (S1), using the release layer as a mask in surface reforming the primary surface of the first thermoplastic sheet (S2), laminating a second thermoplastic sheet so as to cover from above the release layer, configuring a laminate body including the first and second thermoplastic sheet (S3), crimping the laminate body (S4), applying notches from, at a minimum, either the upper or lower surface of the laminate body toward contour lines when viewed in the plane of the release layer (S5), and eliminating the portion that is surrounded by the notches (S6).
Inventors:
CHISAKA SHUNSUKE (JP)
Application Number:
PCT/JP2010/070326
Publication Date:
May 26, 2011
Filing Date:
November 16, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
CHISAKA SHUNSUKE (JP)
CHISAKA SHUNSUKE (JP)
International Classes:
H05K3/46
Foreign References:
| JP2003264369A | 2003-09-19 | |||
| JP2004207490A | 2004-07-22 | |||
| JP2006324574A | 2006-11-30 | |||
| JPS647697A | 1989-01-11 | |||
| JPH05167257A | 1993-07-02 | |||
| JPH07170029A | 1995-07-04 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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