Title:
METHOD FOR MANUFACTURING OPTICAL FILM
Document Type and Number:
WIPO Patent Application WO/2017/188168
Kind Code:
A1
Abstract:
This method for manufacturing an optical film includes a cutting step for cutting a resin layer by applying laser light to a laminated body, which has the resin layer, and a laser light absorbing layer that is provided on one surface of the resin layer. An average absorption rate AA, at which the laser light absorbing layer absorbs light in a 9-11 μm wavelength region, is larger than an average absorption rate AR, at which the resin layer absorbs the light in the 9-11 μm wavelength region, and a ratio TA/TR, i.e., the ratio of a thickness TA of the laser light absorbing layer to a thickness TR of the resin layer, is equal to or higher than 0.8.
Inventors:
MIURA TAKUYA (JP)
Application Number:
PCT/JP2017/016140
Publication Date:
November 02, 2017
Filing Date:
April 24, 2017
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
G02B5/30; B23K26/18; B23K26/38
Domestic Patent References:
| WO2016031776A1 | 2016-03-03 |
Foreign References:
| JP2008073742A | 2008-04-03 | |||
| JP2005189530A | 2005-07-14 | |||
| JP2002343747A | 2002-11-29 | |||
| US20150202858A1 | 2015-07-23 | |||
| US20160107425A1 | 2016-04-21 | |||
| US20130344326A1 | 2013-12-26 | |||
| JP2014508313A | 2014-04-03 | |||
| JP2017019036A | 2017-01-26 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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