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Title:
METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR UNIT
Document Type and Number:
WIPO Patent Application WO/2019/021527
Kind Code:
A1
Abstract:
This method for manufacturing an optical semiconductor unit is provided with: a first step for preparing an optical semiconductor device which has a semiconductor substrate and a first electrode pad formed on the surface of the semiconductor substrate and forming, on the first electrode pad, first bumps which include In; a second step for preparing a circuit device which has a circuit board and a second electrode pad formed on the surface of the circuit board and forming, on the second electrode pad, second bumps which include SnAg; and a third step for, after the first and second steps, disposing the surfaces of the semiconductor substrate and the circuit board so as to face each other and bringing the first bumps and the second bumps into contact with each other, heating the first and second bumps at a temperature lower than the melting point of the second bumps so as to form an eutectic between the first and second bumps, and joining the optical semiconductor device and the circuit device.

Inventors:
YAMAMOTO HIROKAZU (JP)
INOUE NAO (JP)
KAMADA SHINTARO (JP)
Application Number:
PCT/JP2018/011155
Publication Date:
January 31, 2019
Filing Date:
March 20, 2018
Export Citation:
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Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L21/60
Foreign References:
JP2010238887A2010-10-21
JP2000031206A2000-01-28
JPH0832296A1996-02-02
JP2002305216A2002-10-18
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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