METHOD FOR MANUFACTURING ORGANIC DEVICE

Title:

METHOD FOR MANUFACTURING ORGANIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2018/198705

Kind Code:

A1

Abstract:

Provided is a method for manufacturing an organic device 1, the method comprising: a formation step in which a plurality of organic device parts 10 are formed at prescribed intervals in one direction on one main surface 3a of a support substrate 3 that extends in the one direction, each organic device part having at least a first electrode layer 5, an organic functional layer 7, and a second electrode layer 9 laminated in the stated order; a bonding step in which a sealing member 11 that extends in the one direction is bonded along the one direction so that a part of the first electrode layer 5 and a part of the second electrode layer 9 in each organic device part 10 are exposed and so that the sealing member straddles a plurality of the organic device parts 10; and a cutting step in which the plurality of organic device parts 10 onto which the sealing member 11 has been bonded are cut into individual pieces. In the bonding step, the sealing member 11 is bonded onto an organic EL (electroluminescent) part 10 using a pressure-sensitive adhesive, and, in the cutting step, cutting blades B are introduced from the sealing member 11 side.

Inventors:

FUJII TAKASHI (JP)
MATSUMOTO YASUO (JP)
MORISHIMA SHINICHI (JP)

Application Number:

PCT/JP2018/014548

Publication Date:

November 01, 2018

Filing Date:

April 05, 2018

Export Citation:

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Assignee:

SUMITOMO CHEMICAL CO (JP)

International Classes:

H05B33/10; B26D7/08; B26F1/44; H01L51/50; H05B33/04

Domestic Patent References:

WO2016017807A1	2016-02-04
WO2010055746A1	2010-05-20

Foreign References:

JP2008077854A	2008-04-03
JP2017052964A	2017-03-16
JP2010103040A	2010-05-06
JP2010103040A	2010-05-06

Other References: