Title:
METHOD OF MANUFACTURING PACKAGE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/061865
Kind Code:
A1
Abstract:
Provided is a method of manufacturing a package structure, the method comprising: a step for applying a latex of a synthetic polyisoprene having a weight-average molecular weight of 500,000 to 5,000,000 and/or a styrene-isoprene-styrene block copolymer having a weight-average molecular weight of 100,000 to 300,000 to at least one side of a first sheet substrate and/or a second sheet substrate; a step for obtaining a laminate by sandwiching a product to be packaged such that the first sheet substrate and the second sheet substrate contact each other with the latex-coated surface of the first sheet substrate and/or the second sheet substrate interposed therebetween; a step for obtaining a compressed laminate by compressing, at a temperature of 100°C or less, at least the part of the laminate at which the first sheet substrate and the second sheet substrate contact each other with the latex-coated surface interposed therebetween; and a step for sterilizing the compressed laminate.
Inventors:
SATOH YOSHITAKA (JP)
Application Number:
PCT/JP2017/033711
Publication Date:
April 05, 2018
Filing Date:
September 19, 2017
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
A61F13/02; B65B55/08; C09J109/00; C09J109/08; C09J193/04
Domestic Patent References:
| WO2010110130A1 | 2010-09-30 |
Foreign References:
| JP2013513456A | 2013-04-22 | |||
| JP2008517097A | 2008-05-22 | |||
| JP2002502777A | 2002-01-29 |
Other References:
See also references of EP 3520750A4
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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