Title:
METHOD FOR MANUFACTURING PATTERNED SUBSTRATE, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/213056
Kind Code:
A1
Abstract:
A method for manufacturing a patterned substrate and a method for manufacturing a circuit board in which the patterned substrate obtained by the manufacturing method is used, the method for manufacturing a patterned substrate comprising: a step 1 for pressure-bonding a photosensitive transfer material provided with a temporary support and a photosensitive resin composition layer onto a substrate provided with an electroconductive layer; a step 2 for exposing the photosensitive resin composition layer; a step 3 for taking up the substrate provided with the exposed photosensitive resin composition layer and forming a roll; and a step 4 for opening the rolled-up substrate, developing the exposed photosensitive resin composition layer, and forming a pattern. A step a for peeling the temporary support from the photosensitive transfer material is provided upstream of step 3, and the photosensitive resin composition layer is a layer comprising a chemically amplified positive photosensitive resin composition.
Inventors:
FUJIMOTO SHINJI (JP)
SATO MORIMASA (JP)
KATAYAMA AKIO (JP)
SATO MORIMASA (JP)
KATAYAMA AKIO (JP)
Application Number:
PCT/JP2017/020695
Publication Date:
December 14, 2017
Filing Date:
June 02, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/38; G03F7/004; G03F7/039; G03F7/09; G06F3/041; G06F3/044
Foreign References:
| JP2002266085A | 2002-09-18 | |||
| JP2001125274A | 2001-05-11 | |||
| JP2013152645A | 2013-08-08 | |||
| JP2014016935A | 2014-01-30 | |||
| JP2005266347A | 2005-09-29 | |||
| JP2014085643A | 2014-05-12 | |||
| JP2016099374A | 2016-05-30 | |||
| JP2003140335A | 2003-05-14 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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