Title:
METHOD FOR MANUFACTURING PLATING FILM, AND PLATED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2014/188834
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a plating film having excellent mass-productivity and high uniformity. This method for manufacturing a plating film includes readying a substrate and a plating solution in which Bi and Te are dissolved in an organic solvent functioning as a plating solvent, and applying a voltage between a pair of electrodes immersed in the plating solution and thereby forming a plating film on the substrate.
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Inventors:
SAITO NORIYUKI (JP)
TAKAHASHI KEIKO (JP)
SAITO NOBUHIRO (JP)
IGARASHI SHUICHI (JP)
TAKAHASHI KEIKO (JP)
SAITO NOBUHIRO (JP)
IGARASHI SHUICHI (JP)
Application Number:
PCT/JP2014/061239
Publication Date:
November 27, 2014
Filing Date:
April 22, 2014
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
C25D9/08; C25D5/18; H01L21/368; H01L35/16; H01L35/34
Foreign References:
JPH05271995A | 1993-10-19 | |||
JPH1070317A | 1998-03-10 | |||
JP2007525598A | 2007-09-06 | |||
JP2011521105A | 2011-07-21 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Patent business corporation wings international patent firm (JP)
Patent business corporation wings international patent firm (JP)
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