Title:
METHOD FOR MANUFACTURING POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/035250
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for manufacturing a polishing composition for which dispersion stability as an undiluted solution is good and which even when diluted, for example, at a high ratio, is able to achieve good surface quality. A method for manufacturing a polishing composition is provided. Said manufacturing method comprises a step for diluting an undiluted polishing composition solution containing abrasive grains, a basic compound, a water-soluble polymer, and water so that the pH change is at least 0.15. For the undiluted polishing composition solution, an index (A) determined from the relational expression: (A) = [(CA) x (CP)]/(pHC) (in the relational expression, (CA) is the content (mass%) of abrasive grains in the undiluted polishing composition solution, (CP) is the content (mass%) of water-soluble polymer in the undiluted polishing composition solution, and (pHC) is the pH value of the undiluted polishing composition solution) is not more than 0.8. The molarity of the water-soluble polymer in the polishing composition after the dilution is at least 7.0 x 10-8 moles/L.
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Inventors:
TSUCHIYA KOHSUKE (JP)
KAWASAKI YUSUKE (JP)
KAWASAKI YUSUKE (JP)
Application Number:
PCT/JP2015/003830
Publication Date:
March 10, 2016
Filing Date:
July 29, 2015
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Foreign References:
| JP2013222863A | 2013-10-28 | |||
| JP2014130966A | 2014-07-10 | |||
| JP2014090100A | 2014-05-15 | |||
| JP2009231486A | 2009-10-08 | |||
| JP2013034026A | 2013-02-14 | |||
| JP2006352043A | 2006-12-28 |
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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