Title:
METHOD FOR MANUFACTURING POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2015/186594
Kind Code:
A1
Abstract:
With the development of miniaturized, light weight and highly functional electronic information equipment, etc., superior heat resistance, transparency, surface smoothness, and optical properties are sought in films used for electric and electronic members, optical device members, etc. An objective of the present invention is to provide a high yield, efficient method for manufacturing thinner polyimide films that exhibit excellent heat resistance, surface smoothness, optical characteristics, and transparency. This method, which is for manufacturing a polyimide film having a surface roughness (Rz) of less than 0.08μm, comprises steps (A)-(C). Step (A): a step in which a metal laminate (A) is obtained by layering a solvent-soluble resin (A) on some or all of the surface of a metal material having a specular gloss of at least 200 and a surface roughness (Rz) of at most 0.5μm. Step (B): a step in which a metal laminate (B) is obtained by layering a polyimide resin (B) different to the solvent-soluble resin (A) on the surface of the solvent-soluble resin (A) layer of the metal laminate (A). Step (C): a step in which a polyimide film is obtained by peeling the polyimide resin (B) layer from the metal laminate (B).
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Inventors:
UCHIYAMA SHOKO (JP)
TADA KENTA (JP)
KURITA TOMOHARU (JP)
TADA KENTA (JP)
KURITA TOMOHARU (JP)
Application Number:
PCT/JP2015/065353
Publication Date:
December 10, 2015
Filing Date:
May 28, 2015
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08J5/18; B29C41/02; B29C41/24; B32B15/08; B32B15/088; C08G73/10
Domestic Patent References:
| WO2014041816A1 | 2014-03-20 |
Foreign References:
| JP2004322441A | 2004-11-18 | |||
| JP2008284834A | 2008-11-27 | |||
| JP2012229402A | 2012-11-22 | |||
| JPS62214912A | 1987-09-21 |
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