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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING POWER DEVICE COOLER
Document Type and Number:
WIPO Patent Application WO/2017/208550
Kind Code:
A1
Abstract:
[Problem] To provide a method for manufacturing a power device cooler, the method enabling cost reduction, achieving a preferable joint with a heat-emitting body in which a power device is assembled, and improving productivity. [Solution] After a first and a second case and a fin that constitute a cooler and are made of aluminum are brazed by means of non-corrosive flux and brazing filler metal, flux residue attached to at least a heat receiving surface of the first and second cases that is to be joined to a heat-emitting body in which a power device is assembled is removed by wet blasting by which a mixture of an abrasive comprising polygonal alumina particles with a central grain size of 4 to 250 μm and a liquid is projected using compressed air.

Inventors:
KUBOTA Etsuro (Nippon Light Metal CompanyLtd.,161,Kambara,Shimizu-ku,Shizuoka-sh, Shizuoka 97, 〒4213297, JP)
HIRAYAMA Tomoyuki (Nippon Light Metal CompanyLtd.,161,Kambara,Shimizu-ku,Shizuoka-sh, Shizuoka 97, 〒4213297, JP)
HIRANO Yutaka (Nippon Light Metal CompanyLtd.,161,Kambara,Shimizu-ku,Shizuoka-sh, Shizuoka 97, 〒4213297, JP)
Application Number:
JP2017/008413
Publication Date:
December 07, 2017
Filing Date:
March 03, 2017
Export Citation:
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Assignee:
NIPPON LIGHT METAL COMPANY,LTD. (2-20, Higashi-shinagawa 2-chomeShinagawa-k, Tokyo 28, 〒1408628, JP)
International Classes:
H01L23/36; H01L23/473; H01L25/07; H01L25/18
Attorney, Agent or Firm:
NAKAMOTO Kikuhiko (37-11, Honkomagome 5-chomeBunkyo-k, Tokyo 21, 〒1130021, JP)
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