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Title:
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2011/105440
Kind Code:
A1
Abstract:
A printed circuit board obtained by a method of manufacturing a printed circuit board has a prescribed component (90) mounted upon at least one of the obverse face or the reverse face thereof. The method of manufacture comprises the steps of preparing a CFRP core (10); forming a through hole (1) that passes through the CFRP core (10) from the obverse face to the reverse face, such that a region is included therein, when viewed in the horizontal plane, whereupon the prescribed component (90) is mounted; and embedding an insulating GFRP core (30) within the through hole (1) by filling the through hole (1) with insulating resin (24) and causing the resin (24) to harden. With the manufacturing method, it is not difficult to form a circuit, and the component (90) that is mounted upon the printed circuit is not affected by stray capacitance from the CFRP.

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Inventors:
OSUGA HIROYUKI (JP)
SAMEJIMA SOHEI (JP)
SAKURADA KAZUHITO (JP)
YAGASAKI AKIRA (JP)
HINATA TATSUYA (JP)
Application Number:
PCT/JP2011/054015
Publication Date:
September 01, 2011
Filing Date:
February 23, 2011
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
NIPPON AVIONICS CO LTD (JP)
OSUGA HIROYUKI (JP)
SAMEJIMA SOHEI (JP)
SAKURADA KAZUHITO (JP)
YAGASAKI AKIRA (JP)
HINATA TATSUYA (JP)
International Classes:
H05K3/46
Foreign References:
JP2004119691A2004-04-15
JP2008053362A2008-03-06
JP2009135415A2009-06-18
JP2007019157A2007-01-25
JP2009088173A2009-04-23
JP2009302459A2009-12-24
JPH1140902A1999-02-12
Other References:
See also references of EP 2542041A4
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
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Claims:



 
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