Title:
METHOD FOR MANUFACTURING PRINTED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/150551
Kind Code:
A1
Abstract:
The operation rate of printing devices for printing is not 100%, and there is demand for more effective utilization of printing devices. This method for manufacturing a printed substrate has: a first printing step for printing electroconductive ink (11) onto a flexible, insulating, and thin-plate-shaped base plate (21); and a second printing step for printing, after the first printing step and in a layer form, a varnish (31) having insulation properties onto at least a part of the portion marked with the electroconductive ink (11).
Inventors:
IMAIE HIROHISA (JP)
Application Number:
PCT/JP2017/006015
Publication Date:
August 23, 2018
Filing Date:
February 17, 2017
Export Citation:
Assignee:
IMAIE HIROHISA (JP)
International Classes:
H05K3/12; B41M1/30; H05K1/02; H05K1/03; H05K3/22; H05K3/28; H05K3/46
Foreign References:
| JP2003283112A | 2003-10-03 | |||
| JP2005228298A | 2005-08-25 | |||
| JP2012510115A | 2012-04-26 |
Attorney, Agent or Firm:
UEMURA Takaaki (JP)
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