Title:
METHOD OF MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2007/072872
Kind Code:
A1
Abstract:
An efficient and novel method of manufacturing a printed wiring board is provided.
The method of manufacturing a printed wiring board (Fig. 1B) includes a step (Fig.
2A) of preparing two sets of cupper coating laminates; a step (Fig. 2B) of sticking
the cupper coating laminates together; a step (Figs. 2C-2E) of forming lands
on both surfaces of the laminates; steps (Figs. 2F-2L) of forming resin layers
on both sides of the laminates, and making holes to form via holes in the resin layers,
respectively; a step (Fig. 2M) of further forming resin layers on the laminates,
and making holes to form via holes in the resin layers; a step (Fig. 2N) of separating
the laminates; and a step (Figs. 2O-2T) of making holes from a stuck surface of
separated laminates to form via holes, wherein a direction of via holes (33-1,
33-2) formed in the resin layer is reverse to those (42) formed in the laminates.
Inventors:
IWATA YOSHIYUKI (JP)
Application Number:
PCT/JP2006/325402
Publication Date:
June 28, 2007
Filing Date:
December 20, 2006
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
IWATA YOSHIYUKI (JP)
IWATA YOSHIYUKI (JP)
International Classes:
H05K3/46
Foreign References:
| JP2005072063A | 2005-03-17 | |||
| JP2004235323A | 2004-08-19 | |||
| JP2000323613A | 2000-11-24 | |||
| EP0678918A2 | 1995-10-25 |
Other References:
See also references of EP 1835792A4
Attorney, Agent or Firm:
TAKAHASHI, Toshihiro (Ogikubo Sunny Garden 4-28-9, Ogikubo, Suginami-ku Tokyo51, JP)
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