Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND COPPER FOIL FOR LASER PROCESSING
Document Type and Number:
WIPO Patent Application WO/2013/133269
Kind Code:
A1
Abstract:
An objective of the present invention is to provide a method for manufacturing a printed wiring board that has fewer manufacturing steps, has superior laser processing properties, and can satisfactorily form a wire pattern; and a copper foil for laser processing and a copper clad laminate. To achieve this objective, the method for manufacturing a printed wiring board according to the present invention is a method in which via holes for interlayer connections are formed by directly irradiating infrared laser light onto a readily-meltable laser absorption layer of a laminated body. In the laminated body, copper foil for laser processing provided on the surface thereof with the readily-meltable laser absorption layer which absorbs infrared laser light and has a faster etching rate with respect to copper etching fluid than the copper foil, and another conductive layer, are laminated with the interposition of an insulating layer. The readily-meltable laser absorption layer is removed from the surface of the copper foil in a desmearing step for removing smears in the via holes and/or a micro-etching process which serves as a pretreatment for an electroless plating step.

Inventors:
FUJII JOJI (JP)
TSUYOSHI HIROAKI (JP)
IIDA HIROTO (JP)
YOSHIKAWA KAZUHIRO (JP)
MATSUDA MITSUYOSHI (JP)
Application Number:
JP2013/055988
Publication Date:
September 12, 2013
Filing Date:
March 05, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H05K3/00; B23K26/38; C23F1/00; C25D7/06
Foreign References:
JP2009111133A2009-05-21
JP2001288595A2001-10-19
JP2001226796A2001-08-21
JP2004006611A2004-01-08
JP2006339270A2006-12-14
JPH11346060A1999-12-14
JP2004006612A2004-01-08
JP2004006613A2004-01-08
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
Download PDF:
Claims: