Title:
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND COPPER FOIL FOR LASER PROCESSING
Document Type and Number:
WIPO Patent Application WO/2013/133269
Kind Code:
A1
Abstract:
An objective of the present invention is to provide a method for manufacturing a printed wiring board that has fewer manufacturing steps, has superior laser processing properties, and can satisfactorily form a wire pattern; and a copper foil for laser processing and a copper clad laminate. To achieve this objective, the method for manufacturing a printed wiring board according to the present invention is a method in which via holes for interlayer connections are formed by directly irradiating infrared laser light onto a readily-meltable laser absorption layer of a laminated body. In the laminated body, copper foil for laser processing provided on the surface thereof with the readily-meltable laser absorption layer which absorbs infrared laser light and has a faster etching rate with respect to copper etching fluid than the copper foil, and another conductive layer, are laminated with the interposition of an insulating layer. The readily-meltable laser absorption layer is removed from the surface of the copper foil in a desmearing step for removing smears in the via holes and/or a micro-etching process which serves as a pretreatment for an electroless plating step.
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Inventors:
FUJII JOJI (JP)
TSUYOSHI HIROAKI (JP)
IIDA HIROTO (JP)
YOSHIKAWA KAZUHIRO (JP)
MATSUDA MITSUYOSHI (JP)
TSUYOSHI HIROAKI (JP)
IIDA HIROTO (JP)
YOSHIKAWA KAZUHIRO (JP)
MATSUDA MITSUYOSHI (JP)
Application Number:
PCT/JP2013/055988
Publication Date:
September 12, 2013
Filing Date:
March 05, 2013
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B23K26/38; H05K3/00; C23F1/00; C25D7/06
Foreign References:
| JP2009111133A | 2009-05-21 | |||
| JP2001288595A | 2001-10-19 | |||
| JP2001226796A | 2001-08-21 | |||
| JP2004006611A | 2004-01-08 | |||
| JP2006339270A | 2006-12-14 | |||
| JPH11346060A | 1999-12-14 | |||
| JP2004006612A | 2004-01-08 | |||
| JP2004006613A | 2004-01-08 |
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
Katsuhiro Yoshimura (JP)
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Claims: