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Title:
METHOD FOR MANUFACTURING PROCESSED SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, AND COMPOSITION FOR FORMING TEMPORARY ADHESIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2022/045278
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a processed substrate, the method including: a step for forming a temporary adhesive layer on the surface of one member from among a substrate and a support; a step for smoothing the surface of the temporary adhesive layer on the side opposite from the surface in contact with the substrate, or the surface of the temporary adhesive layer on the side opposite from the surface in contact with the support, through at least one method from among polishing and grinding; a step for bringing the member on which the temporary adhesive layer is not formed, from among the substrate and the support, into contact with the smoothed surface; and a step for processing the surface of the substrate that is opposite from the surface in contact with the temporary adhesive layer, the temporary adhesive layer containing an inorganic filler. Also provided are a method for manufacturing a semiconductor element that includes the method for manufacturing a processed substrate, and a composition for forming a temporary adhesive layer that has exceptional substrate processability.

Inventors:
SAIE TOSHIYUKI (JP)
Application Number:
PCT/JP2021/031454
Publication Date:
March 03, 2022
Filing Date:
August 27, 2021
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B24B7/04; B23Q3/08; B24B37/04; B24B41/06; H01L21/304
Foreign References:
JP2018049973A2018-03-29
JP2009045728A2009-03-05
JP2015005636A2015-01-08
JP2017103441A2017-06-08
JP2013084770A2013-05-09
JP2017103441A2017-06-08
JP2012174956A2012-09-10
JP2010251722A2010-11-04
JP2018037558A2018-03-08
JPS6236663A1987-02-17
JPS6236663A1987-02-17
JPS61226746A1986-10-08
JPS61226746A1986-10-08
JPS61226745A1986-10-08
JPS61226745A1986-10-08
JPS62170950A1987-07-28
JPS62170950A1987-07-28
JPS6334540A1988-02-15
JPS6334540A1988-02-15
JPH07230165A1995-08-29
JPH07230165A1995-08-29
JPH0862834A1996-03-08
JPH0862834A1996-03-08
JPH0954432A1997-02-25
JPH0954432A1997-02-25
JPH095988A1997-01-10
JPH095988A1997-01-10
JP2001330953A2001-11-30
Other References:
See also references of EP 4205902A4
Attorney, Agent or Firm:
SIKS & CO. (JP)
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