Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MANUFACTURING PROXIMITY SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/100499
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a proximity sensor, in which the probability of short shot occurring is low. A method for manufacturing a proximity sensor comprising: a cylindrical casing 10 in which an opening 11 is formed at one end thereof; an electronic component housed in the casing 10; a cylindrical clamp 20, one end of which is inserted into the casing 10 from the opening 11; a cable 35 having cable wires 34 inserted into the clamp 20 from the other end of the clamp and electrically connected to the electronic component, and a protective covering for covering the cable wires 34; and a ring component 36 provided on the outer periphery of the cable 35 so as to cover an end part 35a of the protective covering; wherein the method for manufacturing a proximity sensor includes a step for positioning the end part 35a of the protective covering inside a cavity 57 of a die 50, a step for fixing the cable 35 only in an outer part of the cavity 57, and a step for running a resin into the cavity 57 and thereby molding the ring component 36.

Inventors:
KATSURA HIROTO (JP)
UEDA NORIYOSHI (JP)
INOUE DAISUKE (JP)
USHIRO YUKI (JP)
Application Number:
JP2019/040582
Publication Date:
May 22, 2020
Filing Date:
October 16, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B29C45/14; B29C45/26
Foreign References:
JP2017103096A2017-06-08
JP2014199740A2014-10-23
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Download PDF:



 
Previous Patent: CONTACT DEVICE

Next Patent: CONTACT DEVICE