Title:
METHOD FOR MANUFACTURING RESIN LAMINATE WITH WIRING PATTERN
Document Type and Number:
WIPO Patent Application WO/2017/090386
Kind Code:
A1
Abstract:
This method for manufacturing a resin laminate with a wiring pattern is provided with: a step for providing an etching resist layer (3) or a wiring pattern layer (14) on the surface of a copper layer (2, 12) in a laminate comprising the copper layer and a resin layer (1, 11) containing a polyvinyl acetal resin, so that first openings (8, 18) through which the copper layer is exposed are formed; and a step for removing the copper layer exposed through the first openings using an etching solution that has copper-etching capability and that essentially does not contain chlorine, and thereby causing the copper layer-side surface of the resin layer to become exposed.
Inventors:
MATSUSHIMA TOSHIFUMI (JP)
Application Number:
PCT/JP2016/082459
Publication Date:
June 01, 2017
Filing Date:
November 01, 2016
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H05K3/06; B32B15/08; C23F1/00; C23F1/18; G06F3/041; H01B13/00
Foreign References:
| JP2006124786A | 2006-05-18 | |||
| JP2007102002A | 2007-04-19 | |||
| JP2007109982A | 2007-04-26 | |||
| JP2012522895A | 2012-09-27 | |||
| JP2010087213A | 2010-04-15 |
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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