Title:
METHOD FOR MANUFACTURING RESIN MOLDED BODY AND MOLDING DIE FOR MOLDING SAME
Document Type and Number:
WIPO Patent Application WO/2019/082565
Kind Code:
A1
Abstract:
In the present invention, in one die 21, a plurality of electroconductive busbars 11, which are bonded to each other by a tie bar 12, are set. In another die 31 the bond is broken by the advancement of a cutting punch 32, which is set advanceably and retreatably, inside a cavity in a molding die 20. The cavity is for filling with a resin, where once the bond has been broken, the inside of the cavity is filled with the resin. A shape-forming surface of the other die 31, which is a die reference surface 33 that forms the product shape of a resin molded body 1 and that is disposed away from the busbars 11 forms a reference surface 5 of the resin molded body 1. Part of a side surface 34 of the cutting punch 32 remains exposed inside the cavity of the molding die 20 even when the cutting punch has retreated, and as a result, part of a wall surface 6 that extends at an angle with respect to the reference surface 5 of the resin molded body 1 is formed by the side surface 34.
Inventors:
NOZAWA HIROKI (JP)
IMAI KIYOSHI (JP)
IMAI KIYOSHI (JP)
Application Number:
PCT/JP2018/035058
Publication Date:
May 02, 2019
Filing Date:
September 21, 2018
Export Citation:
Assignee:
KEIHIN CORP (JP)
International Classes:
B29C45/14; B29C33/14; H01R43/24
Domestic Patent References:
| WO2016076179A1 | 2016-05-19 |
Foreign References:
| JP2012125931A | 2012-07-05 |
Attorney, Agent or Firm:
SATO & ASSOCIATES (JP)
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