Title:
METHOD FOR MANUFACTURING RESIN STRUCTURE AND RESIN STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/171923
Kind Code:
A1
Abstract:
This method for manufacturing a resin structure is provided with: a step for forming a resin molded article having an electronic component embedded therein, by mounting the electronic component on a sheet, disposing the sheet in a molding die, and filling the molding die with a resin; a step for separating the sheet from the resin molded article to thereby expose the joint surface, of the resin molded article, to which the sheet was joined; a step for printing, on the joint surface, wiring to be connected to the electronic component; and a step for forming, on the joint surface, a resin projection structure having a height of 1 mm or more by using a 3D printer.
Inventors:
KAWAI WAKAHIRO (JP)
ITO KENTA (JP)
IGI YASUTAKA (JP)
KATSURAGAWA TETSUYA (JP)
ITO KENTA (JP)
IGI YASUTAKA (JP)
KATSURAGAWA TETSUYA (JP)
Application Number:
PCT/JP2019/005772
Publication Date:
September 12, 2019
Filing Date:
February 18, 2019
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H05K3/00; B29C45/14; B29C45/26; B29C64/106; B29C64/40; B33Y10/00; B33Y80/00; H05K1/18
Foreign References:
| JP2010272756A | 2010-12-02 | |||
| JP2015213162A | 2015-11-26 | |||
| JP2017130553A | 2017-07-27 | |||
| JP2017167058A | 2017-09-21 | |||
| JPH05315475A | 1993-11-26 | |||
| JP2015176944A | 2015-10-05 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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