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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING RESIN THIN FILM STRIPPED PIECES
Document Type and Number:
WIPO Patent Application WO/2019/189246
Kind Code:
A1
Abstract:
The present invention is a method for manufacturing resin thin film stripped pieces, said method including: a step (1) for obtaining a multilayer film by forming a resin thin film on a base material film; a step (2) for forming cracks in the resin thin film by pressing the multilayer film with a member having an indented/protruding shape; and a step (3) for obtaining stripped pieces by stripping the resin thin film from the base material film. The step (2) is preferably performed with a pressing pressure of 100 MPa or less. The resin thin film is preferably formed of a cured product of a photo-curable liquid crystal composition. The resin thin film is preferably a cholesteric resin layer.

Inventors:
WARABIMINAMI YUSUKE (JP)
Application Number:
PCT/JP2019/012980
Publication Date:
October 03, 2019
Filing Date:
March 26, 2019
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
B29C41/34; G02B5/30; G02F1/13
Domestic Patent References:
WO1998000428A11998-01-08
Foreign References:
JP2015027743A2015-02-12
JPH03255875A1991-11-14
JP2005532439A2005-10-27
JP2001261739A2001-09-26
JP2001261739A2001-09-26
US20020017633A12002-02-14
JP2005289881A2005-10-20
JP2004115414A2004-04-15
JP2003066214A2003-03-05
JP2003313187A2003-11-06
JP2003342219A2003-12-03
JP2000290315A2000-10-17
JPH0672962A1994-03-15
US6468444B12002-10-22
JP2007176870A2007-07-12
Other References:
See also references of EP 3778171A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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