Title:
METHOD OF MANUFACTURING RING-SHAPED MEMBER
Document Type and Number:
WIPO Patent Application WO/2007/043176
Kind Code:
A1
Abstract:
A method of manufacturing a ring-shaped member in which the outer sides of the
pair of curved parts (3d) of a longitudinal annular blank are pressingly energized
by the molding outer dies (14) of a pressing device (13) in the directions of the
opposite side curved parts (3d) to push open each of the curved parts (3d) to a large
curved part with a large radius of curvature to mold a half-finished product (17),
and the half-finished product (17) is pushed open by a cooperation between the
finishing inner die of the pressing device and a complete round type window part
functioning as the outer die to manufacture the ring-shaped member. Since a yielding
indicated by the ratio of the weight of the ring-shaped member to the weight of
a raw material and a yielding indicated by the ratio of the ring-shaped member
to the blank are increased, a manufacturing cost for the ring-shaped member can
be reduced.
Inventors:
KANEMITSU TOSHIAKI (JP)
KANEMITSU SHUJI (JP)
ODA MISAO (JP)
OHNISHI MASATAKA (JP)
FUJII NAOKI (JP)
ODA KAZUYUKI (JP)
KANEMITSU SHUJI (JP)
ODA MISAO (JP)
OHNISHI MASATAKA (JP)
FUJII NAOKI (JP)
ODA KAZUYUKI (JP)
Application Number:
PCT/JP2005/018840
Publication Date:
April 19, 2007
Filing Date:
October 13, 2005
Export Citation:
Assignee:
KANEMITSU CORP (JP)
KANEMITSU TOSHIAKI (JP)
KANEMITSU SHUJI (JP)
ODA MISAO (JP)
OHNISHI MASATAKA (JP)
FUJII NAOKI (JP)
ODA KAZUYUKI (JP)
KANEMITSU TOSHIAKI (JP)
KANEMITSU SHUJI (JP)
ODA MISAO (JP)
OHNISHI MASATAKA (JP)
FUJII NAOKI (JP)
ODA KAZUYUKI (JP)
International Classes:
B21D53/16; B21D28/06
Foreign References:
JPH0647139B2 | 1994-06-22 | |||
JPS455144B1 | ||||
JPS58128231A | 1983-07-30 | |||
JPS62203633A | 1987-09-08 |
Attorney, Agent or Firm:
SUZUE, Shoji et al. (2-4 Komatsubara-cho, Kita-ku, Osaka-sh, Osaka 18, JP)
Download PDF:
Previous Patent: DOOR AND METHOD OF INSTALLING THE DOOR
Next Patent: INSERT, TEST TRAY AND SEMICONDUCTOR TESTING APPARATUS
Next Patent: INSERT, TEST TRAY AND SEMICONDUCTOR TESTING APPARATUS