Title:
METHOD FOR MANUFACTURING SEALING RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2012/066902
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for manufacturing a sealing resin sheet, the method being capable of manufacturing at reduced manufacturing cost the sealing resin sheet having a desired thickness.
The present invention is a method for manufacturing a sealing resin sheet (1) for sealing an electronic component mounted on a circuit board. A liquid resin (21) is placed in a mold (20) and is brought into a semi-cured state by heat treatment and formed into a resin body (22). The formed resin body (22) is heated at a temperature lower than the curing temperature and pressurized and stretched. The thickness of the resin body (22) is greater than the thickness of the sealing resin sheet (1).
Inventors:
IDA YUYA (JP)
KITAYAMA HIROKI (JP)
KATSUBE AKIO (JP)
WATANABE KOJI (JP)
KITAYAMA HIROKI (JP)
KATSUBE AKIO (JP)
WATANABE KOJI (JP)
Application Number:
PCT/JP2011/074401
Publication Date:
May 24, 2012
Filing Date:
October 24, 2011
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
IDA YUYA (JP)
KITAYAMA HIROKI (JP)
KATSUBE AKIO (JP)
WATANABE KOJI (JP)
IDA YUYA (JP)
KITAYAMA HIROKI (JP)
KATSUBE AKIO (JP)
WATANABE KOJI (JP)
International Classes:
B29C43/02; B29C43/12; B29C43/18; B29C43/56; C09K3/10
Foreign References:
| JP2010179507A | 2010-08-19 | |||
| JP2000290471A | 2000-10-17 | |||
| JP2010003857A | 2010-01-07 | |||
| JP2006175638A | 2006-07-06 |
Attorney, Agent or Firm:
FUKUNAGA Masaya (JP)
Masaya Fukunaga (JP)
Masaya Fukunaga (JP)
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Claims: