Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MOUNTING DEVICE, AND MEMORY DEVICE MANUFACTURED BY METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/158935
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for manufacturing a semiconductor device, a semiconductor mounting device, and a memory device manufactured by the method for manufacturing a semiconductor device, with which it is possible to shorten the manufacturing time of a semiconductor device in which chip components are laminated, and to suppress the occurrence of joining defects and the like between the chip components. Specifically, provided is a method for manufacturing a semiconductor device 1 in which semiconductor wafers W are laminated, wherein the method includes: a pre-bonding step in which the plurality of semiconductor wafers W are laminated and heated with an NCF interposed therebetween, pressure is applied to the semiconductor wafers W so that the gap between a through silicon via Pb provided to each chip component P, and a through silicon via Pb of the adjacent semiconductor wafer W is kept within a prescribed range Gt, and a pre-bonded laminate WL is produced; a cutting step for cutting the pre-bonded laminate WL with a dicing blade 18 to produce pre-bonded laminate chip components PL in which the chip components P are laminated; and a bonding step in which the pre-bonded laminate chip components PL are heated to the melting point of the solder Pa or higher and pressure is applied to produce laminate chip components PL.
Inventors:
ASAHI NOBORU (JP)
ARAI YOSHIYUKI (JP)
MIYAMOTO YOSHINORI (JP)
AOKI SHIMPEI (JP)
NIMURA MASATSUGU (JP)
ARAI YOSHIYUKI (JP)
MIYAMOTO YOSHINORI (JP)
AOKI SHIMPEI (JP)
NIMURA MASATSUGU (JP)
Application Number:
PCT/JP2016/060079
Publication Date:
October 06, 2016
Filing Date:
March 29, 2016
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2013133015A1 | 2013-09-12 | |||
| WO2010109985A1 | 2010-09-30 |
Foreign References:
| JP2013065835A | 2013-04-11 | |||
| JP2008294382A | 2008-12-04 | |||
| JP2008130706A | 2008-06-05 | |||
| JP2007250886A | 2007-09-27 | |||
| JP2012160634A | 2012-08-23 |
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