METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUTOR DEVICE, NARROW PITCH CONNECTOR, ELECTROSTATIC ACTUATOR, PIEZOELECTRIC ACTUATOR, INK JET HEAD, INK JET PRINTER, MICROMACHINE, LIQUID CRYSTAL PANEL, AND ELECTRONIC DEVICE

Title:

Document Type and Number:

WIPO Patent Application WO/2000/059050

Kind Code:

A1

Abstract:

A method of manufacturing a semiconductor device which causes no short circuit therein because of dust floating in the air, a semiconductor device, a narrow pitch connector, a micromachine such as an electrostatic actuator or a piezoelectric actuator, and an ink jet head, an ink jet printer, a liquid crystal panel, and an electronic apparatus including these devices are disclosed. The method of manufacturing a plurality of semiconductor devices (20) by dicing a silicon wafer (30) comprises making grooves (30a) covered with insulating layers in the silicon wafer and extending across dicing lines and dicing the wafer along the dicing lines.

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Inventors:

SATO EIICHI (JP)

Application Number:

PCT/JP2000/002072

Publication Date:

October 05, 2000

Filing Date:

March 31, 2000

Export Citation:

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Assignee:

SEIKO EPSON CORP (JP)
SATO EIICHI (JP)

International Classes:

H01L21/78; H01L23/552; H01L23/58; H01L41/08; H02N2/04; B81B1/00; B81B7/00; H01R31/06; (IPC1-7): H01L41/08; H01L21/78; H01R24/00

Domestic Patent References:

WO1996031921A1

1996-10-10

Foreign References:

JPH0864557A	1996-03-08
JPH05259274A	1993-10-08
JPH0423451A	1992-01-27
JPH03152955A	1991-06-28
JPH02100340A	1990-04-12
JPS62209828A	1987-09-16
JPS61115332A	1986-06-02
JPH0991388A	1997-04-04
JPH10106695A	1998-04-24

Other References: