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Patent Searching and Data


Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/078083
Kind Code:
A1
Abstract:
Provided is a method of manufacturing semiconductor devices, wherein the target space ratio for a monitor pattern of an inspection substrate is determined so as to have a ratio different from 1:1. The range of space ratios within a library is determined to be a range including the target space ratio, but not including 1:1. A prescribed processing is executed upon the inspection substrate, to form a monitor pattern on a film to be processed. Then the dimensions of the monitor pattern are measured. The dimensions of the monitor pattern are converted to dimensions of a pattern of a film to be processed having a space ratio of 1:1, and the processing condition for the prescribed processing is corrected on the basis of the converted dimensions of the pattern of the film to be processed. Then, the prescribed processing is executed upon a wafer with the corrected processing condition, to form a pattern having a space ratio of 1:1 on the film to be processed.

Inventors:
TANAKA KEISUKE (JP)
MORIYA MACHI (JP)
Application Number:
PCT/JP2010/072783
Publication Date:
June 30, 2011
Filing Date:
December 17, 2010
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
TANAKA KEISUKE (JP)
MORIYA MACHI (JP)
International Classes:
H01L21/027; G03F7/38; G03F7/40; H01L21/3065
Foreign References:
JP2008530579A2008-08-07
JP2008311645A2008-12-25
JP2007305971A2007-11-22
JP2005064023A2005-03-10
JP2004529330A2004-09-24
JPS6435916A1989-02-07
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
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