Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2006/070452
Kind Code:
A1
Abstract:
A method for manufacturing a semiconductor device, which comprises providing a tank (21) for storing a plating solution in addition to a plating treatment tank (20), and arranging magnets (33a to 33d) in the plating solution storage tank, specifically, arranging a magnet (33a) in a dam provided at the inlet of the plating solution (27) in the plating solution storage tank (21), a magnet (33b) at the surface layer of the plating solution (27) stored therein, a magnet (33c) in the vicinity of the outlet of the plating solution (27) and a magnet (33d) at a bottom portion of the plating solution (27). The above method can be suitably employed for removing the sludge present in a plating solution efficiently while preventing the fluctuation of the film thickness of a nickel film formed on a wafer.
Inventors:
KANAOKA TAKU (JP)
Application Number:
PCT/JP2004/019602
Publication Date:
July 06, 2006
Filing Date:
December 28, 2004
Export Citation:
Assignee:
RENESAS TECH CORP (JP)
KANAOKA TAKU (JP)
KANAOKA TAKU (JP)
International Classes:
C25D21/18; C25D17/00; C25D7/12; H01L23/12; (IPC1-7): C25D21/18; C25D7/12; C25D17/00; H01L23/12
Foreign References:
| JP2003183896A | 2003-07-03 | |||
| JPH09137299A | 1997-05-27 | |||
| JPH10118634A | 1998-05-12 | |||
| JP2003227000A | 2003-08-15 | |||
| JP2004193211A | 2004-07-08 | |||
| JPH1088387A | 1998-04-07 |
Attorney, Agent or Firm:
Tsutsui, Yamato (6th Floor, Kokusai Chusei Kaikan,, 14,
Gobancho,, Chiyoda-k, Tokyo 76, JP)
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