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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/046695
Kind Code:
A1
Abstract:
This method for manufacturing a semiconductor device is characterized by providing: a first step for providing a resin paste coating (30) by applying a resin paste for bonding that has 5% by mass or less content of a solvent that contains a photocurable component and a heat-curable component to a semiconductor support member (10) for mounting a semiconductor chip; a second step for photocuring the photocurable component by irradiating the coating (30) with light; and a third step for sandwiching, attaching by pressure, and joining the light irradiated coating (32) between the semiconductor support member (10) and a semiconductor chip (50). In addition, this resin paste for bonding is characterized by containing a photopolymerizable compound for which the viscosity at 25°C is 100 Pa·s, a heat-curable compound, and a thermoplastic elastomer and the solvent content being 5% by mass or less.

Inventors:
SUGIURA YOSHIFUMI (JP)
FUJII SHINJIRO (JP)
MORI SHUICHI (JP)
Application Number:
PCT/JP2011/072786
Publication Date:
April 12, 2012
Filing Date:
October 03, 2011
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
SUGIURA YOSHIFUMI (JP)
FUJII SHINJIRO (JP)
MORI SHUICHI (JP)
International Classes:
H01L21/52; C09J5/06; C09J11/00; C09J201/00
Foreign References:
JP2007270130A2007-10-18
JP2008277803A2008-11-13
JP2007258508A2007-10-04
JP2007258425A2007-10-04
JP2010177244A2010-08-12
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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Claims: