Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/183671
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a semiconductor device that can improve production efficiency. In the manufacturing method for a semiconductor device (1) is included a step for imparting a sealing material (7) that seals a semiconductor element (3), providing a release film (F) in a mold facing the semiconductor element (3) and curing the sealing material (7) by an upper mold (22) and a lower mold (24). On the contact side of the release film (F) with the sealing material (7), a metal layer (9) for shielding electromagnetic waves is provided in advance, and in the step for curing the sealing material (7), the metal layer (9) is transferred to the sealing material (7).
Inventors:
KAWAMORI TAKASHI (JP)
SUZUKI NAOYA (JP)
SUZUKI NAOYA (JP)
Application Number:
PCT/JP2013/065590
Publication Date:
December 12, 2013
Filing Date:
June 05, 2013
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/56; H01L23/00; H01L23/28; H05K3/28
Foreign References:
| JP2007287937A | 2007-11-01 | |||
| JPH06275742A | 1994-09-30 | |||
| JP2010123839A | 2010-06-03 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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