METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2017/195517

A1

Disclosed is a method for manufacturing a semiconductor device provided with a semiconductor chip having connection parts, and a wiring circuit substrate having connection parts, the respective connection parts being electrically connected to each other, or provided with a plurality of semiconductor chips having connection parts, the respective connection parts being electrically connected to each other. The connection parts comprise metal. The method is provided with (a) a first step for crimping the semiconductor chip and wiring circuit board, or semiconductor chips together with a semiconductor adhesive disposed therebetween at a temperature that is lower than the melting point of the metal of the connection parts so that the respective connection parts contact each other to obtain a provisionally connected body, (b) a second step for sealing at least a portion of the provisionally connected body using a sealing resin to obtain a sealed, provisionally connected body, (c) and a third step for heating the sealed, provisionally connected body at the melting point temperature or higher of the connection parts to obtain a sealed connected body.

HONDA KAZUTAKA (JP)
CHABANA KOICHI (JP)
SATOU MAKOTO (JP)
NAGAI AKIRA (JP)

PCT/JP2017/014680

November 16, 2017

April 10, 2017

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HITACHI CHEMICAL CO LTD (JP)

H01L21/60; C09J4/02; C09J11/06; C09J163/00; C09J201/00; H01L21/56

JPH10112476A	1998-04-28
JPH1126511A	1999-01-29
JPH07273147A	1995-10-20

HASEGAWA Yoshiki et al. (JP)

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