Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/020864
Kind Code:
A1
Abstract:
According to the present invention, a semiconductor device 1 is manufactured by: preparing a lead frame 2 in which a plurality of circuit pattern forming regions 20 are formed side by side; attaching electronic components to the circuit pattern forming regions 20 to form an electronic circuit unit 3; forming a first sealed body 4 with a sealing resin such that the electronic circuit unit 3 is covered and a plurality of outer leads are exposed; cutting off a portion of a tie bar 23 connecting the plurality of outer leads to thereby form anchor parts respectively on the outer leads and also cutting off the plurality of outer leads and another tie bar 22 connected to the lead frame 2 to thereby form a primary molded body 5; and forming a secondary molded body by forming a second sealed body 6 with a sealing resin so as to cover the anchor parts and the first sealed body 4 of the primary molded body 5.
More Like This:
| WO/2002/043136 | METHOD FOR COATING ELECTRONIC PARTS |
| JP2639858 | METHOD FOR SEALING ELECTRONIC PARTS WITH RESIN |
| JPH07256688 | RESIN MOLD ASSEMBLY |
Inventors:
HARA TAKAYUKI (JP)
Application Number:
PCT/JP2017/021633
Publication Date:
February 01, 2018
Filing Date:
June 12, 2017
Export Citation:
Assignee:
TOKAI RIKA CO LTD (JP)
International Classes:
H01L21/56; H01L23/28; H01L23/50
Foreign References:
| JP2013118215A | 2013-06-13 | |||
| JP2006261242A | 2006-09-28 | |||
| JP2000150765A | 2000-05-30 | |||
| JPH08116009A | 1996-05-07 | |||
| JP2011091194A | 2011-05-06 | |||
| JPH04364766A | 1992-12-17 |
Attorney, Agent or Firm:
HIRATA & PARTNERS (JP)
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