Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/118929
Kind Code:
A1
Abstract:
A method for manufacturing a semiconductor device 1 comprises: a step for preparing a plurality of semiconductor elements 10 each having a first surface 10a on which a connection terminal 10c is formed and a second surface 10b opposite the first surface 10a; a step for preparing a support member 24 comprising a carrier 20 with a curable adhesive layer 22 formed thereon; a step for attaching the plurality of semiconductor elements 10 to the support member 24 with the respective second surfaces 10b of the plurality of semiconductor elements 10 facing the curable adhesive layer 22; a step for curing the curable adhesive layer 22 to fix the plurality of semiconductor elements 10 onto the support member 24; a step for sealing the plurality of semiconductor elements 10 with a sealing material; and a step for removing the carrier 20.
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Inventors:
MATSUBARA HIROAKI (JP)
IKEDA DAISUKE (JP)
OKAWARA KEISUKE (JP)
SOBUE SHOGO (JP)
OGAWA SAEKO (JP)
IKEDA DAISUKE (JP)
OKAWARA KEISUKE (JP)
SOBUE SHOGO (JP)
OGAWA SAEKO (JP)
Application Number:
PCT/JP2021/044321
Publication Date:
June 09, 2022
Filing Date:
December 02, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/12
Domestic Patent References:
| WO2017149810A1 | 2017-09-08 |
Foreign References:
| JP2018009138A | 2018-01-18 | |||
| JP2019129179A | 2019-08-01 | |||
| JP2006222164A | 2006-08-24 | |||
| JP2013168594A | 2013-08-29 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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