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Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/249384
Kind Code:
A1
Abstract:
A method for manufacturing a semiconductor device in which electrodes (65, 64) of semiconductor chips (55, 54) are sequentially connected by a common wire (12), wherein the electrodes (65, 64) are sequentially connected by the wire (12) through: a bump forming step for forming bumps (45e, 45d) on electrodes (65, 64) using a capillary (20); after the bump forming step, a joining step for pressing the side surface of the wire (12) against the bump (45e) using the capillary (20) to join the side surface of the wire (12) to the bump (45e); after the joining step, a looping step for looping the wire (12) to the top of the bump (45d) using the capillary (20); and a joining step for pressing the side surface of the wire (12) against the bump (45d) using the capillary (20) to join the side surface of the wire (12) to the bump (45d).

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Inventors:
SEKINE NAOKI (JP)
HAGIWARA YOSHIHITO (JP)
AKIYAMA SHINICHI (JP)
Application Number:
PCT/JP2021/020152
Publication Date:
December 01, 2022
Filing Date:
May 27, 2021
Export Citation:
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Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60
Domestic Patent References:
WO2018038113A12018-03-01
WO2014171160A12014-10-23
Foreign References:
JP2005303152A2005-10-27
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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