Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR LASER ELEMENT
Document Type and Number:
WIPO Patent Application WO/2017/115792
Kind Code:
A1
Abstract:
A method for manufacturing a semiconductor laser element comprises: a cleaning step in which a semiconductor light emitting element that has a configuration for emitting light from an end surface is held in a plasma sputtering device having a quartz-covered target, and cleaning is performed by irradiating plasma on the end surface using the plasma sputtering device; and a dielectric-film-forming step in which the cleaned semiconductor light emitting element is carried to a film-forming device without being exposed to atmospheric air, and a dielectric film is formed on the cleaned end surface using the film-forming device.
Inventors:
OHKI YUTAKA (JP)
TAJIMA MASAFUMI (JP)
TAJIMA MASAFUMI (JP)
Application Number:
PCT/JP2016/088872
Publication Date:
July 06, 2017
Filing Date:
December 27, 2016
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01S5/028; H01S5/16
Foreign References:
| JP2005079406A | 2005-03-24 | |||
| JPH11269643A | 1999-10-05 | |||
| JPH0856053A | 1996-02-27 | |||
| JP2008300547A | 2008-12-11 | |||
| JP2007150004A | 2007-06-14 | |||
| JP2000138215A | 2000-05-16 | |||
| JPH09162496A | 1997-06-20 | |||
| JP2010073757A | 2010-04-02 | |||
| JP2009231470A | 2009-10-08 |
Other References:
See also references of EP 3399606A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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