Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2013/005646
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for manufacturing a semiconductor light-emitting element whereby no preparation for multiple types of fluorescent sheets is required. The method for manufacturing a semiconductor light-emitting element (10) having an LED die (20) includes steps of arranging an LED die on a fluorescent sheet (11) containing fluorescent substance and adjusting an amount by which said LED die is to be pressed into the fluorescent sheet such that the emission color of the semiconductor light-emitting element has a desired value.
Inventors:
SORIMACHI KAZUAKI (JP)
Application Number:
PCT/JP2012/066586
Publication Date:
January 10, 2013
Filing Date:
June 28, 2012
Export Citation:
Assignee:
CITIZEN HOLDINGS CO LTD (JP)
CITIZEN ELECTRONICS (JP)
SORIMACHI KAZUAKI (JP)
CITIZEN ELECTRONICS (JP)
SORIMACHI KAZUAKI (JP)
International Classes:
H01L33/50; H01L33/00
Domestic Patent References:
| WO2005097938A1 | 2005-10-20 |
Foreign References:
| JP2009229507A | 2009-10-08 | |||
| JP2008145300A | 2008-06-26 | |||
| JP2007311663A | 2007-11-29 | |||
| JP2011253998A | 2011-12-15 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
Aoki 篤 (JP)
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