Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, COMPOSITION, POLYMER, AND METHOD FOR PRODUCING POLYMER
Document Type and Number:
WIPO Patent Application WO/2022/191037
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a method for manufacturing a semiconductor substrate using a composition from which a film having excellent etching resistance, heat resistance, and bending resistance can be formed; a composition; a polymer; and a method for producing a polymer. This method for manufacturing a semiconductor substrate comprises: a step for applying a resist underlayer film-forming composition directly or indirectly to a substrate; a step for forming resist patterns directly or indirectly on the resist underlayer film formed in the application step; and a step for performing etching using the resist patterns as masks, wherein the resist underlayer film-forming composition contains a solvent and a polymer having a repeating unit represented by formula (1). (In formula (1), Ar1 is a divalent group having an aromatic ring with 5-40 membered rings. R0 is a group represented by formula (1-1) or (1-2).) (In formula (1-1) or (1-2), X1 and X2 are each independently a group represented by formula (i), (ii), (iii), or (iv). * is a dangling bond to the carbon atom in formula (1). Ar2, Ar3, and Ar4 are each independently a substituted or unsubstituted aromatic ring with 6-20 membered rings, which forms a condensed ring structure together with adjacent two carbon atoms in formulae (1-1) and (1-2).) (In formula (i), R1 and R2 are each independently a hydrogen atom or a C1-C20 monovalent organic group. In formula (ii), R3 is a hydrogen atom or a C1-C20 monovalent organic group. R4 is a C1-C20 monovalent organic group. In formula (iii), R5 is a C1-C20 monovalent organic group. In formula (iv), R6 is a hydrogen atom or a C1-C20 monovalent organic group.)
Inventors:
YAMADA SHUHEI (JP)
ABE SHINYA (JP)
TSUJI TAKASHI (JP)
UEDA KANAKO (JP)
NAKATSU HIROKI (JP)
MIYAUCHI HIROYUKI (JP)
ABE SHINYA (JP)
TSUJI TAKASHI (JP)
UEDA KANAKO (JP)
NAKATSU HIROKI (JP)
MIYAUCHI HIROYUKI (JP)
Application Number:
PCT/JP2022/009185
Publication Date:
September 15, 2022
Filing Date:
March 03, 2022
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C08G8/00; C08G8/04; C08G8/28; G03F7/11; G03F7/40; H01L21/027
Foreign References:
| JP2012098431A | 2012-05-24 | |||
| KR20190053546A | 2019-05-20 | |||
| KR20200090059A | 2020-07-28 | |||
| KR20210011291A | 2021-02-01 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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