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Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND LIGHT EMITTING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2012/066804
Kind Code:
A1
Abstract:
This method for manufacturing a semiconductor substrate comprises: a step wherein a first region of the surface of a substrate is covered with a mask; a step wherein a surface processing, in which fluorine is adhered to a second region of the surface of the substrate exposed from the mask, is carried out; a step wherein the mask is removed after the step wherein the surface processing is carried out; and a step wherein a semiconductor layer is grown from the first region, from which the mask has been removed, to the second region.

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Inventors:
KAWAGUCHI YOSHIYUKI (JP)
WATANABE KEIICHIRO (JP)
Application Number:
PCT/JP2011/060151
Publication Date:
May 24, 2012
Filing Date:
April 26, 2011
Export Citation:
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Assignee:
KYOCERA CORP (JP)
KAWAGUCHI YOSHIYUKI (JP)
WATANABE KEIICHIRO (JP)
International Classes:
H01S5/343; H01L33/30
Foreign References:
JP2006278477A2006-10-12
JP2000357843A2000-12-26
JP2002217116A2002-08-02
JP2000174393A2000-06-23
JP2004288934A2004-10-14
JP2000340511A2000-12-08
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Claims:



 
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