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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER, PHOTOSENSITIVE ADHESIVE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/017955
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a semiconductor wafer provided with an adhesive layer, which includes: a step wherein a photosensitive adhesive layer is formed by applying a photosensitive adhesive to the whole one surface of a semiconductor wafer by a screen printing method; and a step wherein the photosensitive adhesive layer is brought into a B stage by exposure.

Inventors:
MORI SHUICHI (JP)
FUJII SHINJIROU (JP)
MITSUKURA KAZUYUKI (JP)
Application Number:
PCT/JP2011/067494
Publication Date:
February 09, 2012
Filing Date:
July 29, 2011
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
MORI SHUICHI (JP)
FUJII SHINJIROU (JP)
MITSUKURA KAZUYUKI (JP)
International Classes:
H01L21/52; C09J4/00; C09J201/00
Foreign References:
JP2007258508A2007-10-04
JP2008277803A2008-11-13
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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Claims: