FERRERO SPA (IT)
FERRERO OHG (DE)
ROSSO RENATO (IT)
GB751948A | 1956-07-04 | |||
EP0054229A2 | 1982-06-23 | |||
GB2256120A | 1992-12-02 | |||
DE4035354C1 | 1992-01-09 |
1. | A method for the manufacture of shaped wafers, comprising the operations of: providing moulding means (2, 3) together defining a space, including at least one substantially flat base part and at least one shaped part having a shape corresponding to that to be imparted to the wafers; filling the space with wafer mixture; subjecting the moulding means (2, 3) containing the wafer mixture to a cooking step; and opening the moulding means (2, 3) and extracting the intermediate product (P) resulting from the cooking of the wafer mixture in the moulding means (2, 3) , the cooked product also having at least one flat part (A) and at least one shaped part (C) , characterised in that it includes the step of dimensioning the space so that it has a substantially greater thickness in correspondence with the at least one base part than in correspondence with the at least one shaped part. |
2. | A method according to Claim 1, characterised in that the substantially greater thickness is equal to approximately 2.22.5 mm. |
3. | A method according to Claim 1 or Claim 2, characterised in that the thickness of the at least one shaped part is equal to approximately 11.5 mm. |
4. | A method according to any one of Claims 1 to 3 , characterised in that it also includes the operation of separating, by means of a cutting operation, the at least one shaped part (C) from the at least one base part (A) in the intermediate product (P) formed by the cooking of the wafer mixture in the moulding means (2, . |
5. | A method according to Claim 4 , characterised in that the cutting operation is carried out in a plane substantially parallel to the plane of the respective base part (A) . |
6. | An intermediate product based on cooked wafer mixture, obtained by the method according to any of Claims 1 to 3. |
7. | A wafer based on cooked wafer mixture, obtained by the method of Claim 4 or Claim 5. |
8. | A mould for manufacturing shaped wafers comprising two mould parts (2, 3) which can be coupled together in a general male and female arrangement so as to define together a space for receiving wafer mixture to be cooked in the mould (2, 3) ; the space including at least one substantially flat base part and at least one part shaped to correspond with the shape to be imparted to the wafer, characterised in that the first (2) and second (3) mould parts are shaped and/or coupled together (8) in such a way that, with the first (2) and second (3) mould parts coupled together, the space has a substantially greater thickness in correspondence with the at least one base part (A) than in correspondence with the at least one shaped part (C) . |
9. | A mould according to Claim 8, characterised in that the space has a thickness of approximately 2.22.5 mm in correspondence with the at least one base part . |
10. | A mould according to Claim 8 or Claim 9, characterised in that the space has a thickness of approximately 11.5 mm in correspondence with the at least one shaped part (C) . |
INTERMEDIATE PRODUCT AND A WAFER OBTAINED BY THIS
METHOD, AND AN ASSOCIATED MOULD
The present invention concerns a method for
manufacturing shaped wafers according to the preamble of Claim 1.
Specifically, the present invention concerns the
manufacture of wafers which are generally shaped, for
example having a generally hemispherical cup or basin
shape, rather than the usual flat form of wafers used,
for example, to produce the filled biscuits generally
known as wafer biscuits .
EP-A-0 054 229 and EP-A-0 221 033 describe solutions in
which hemispherical wafer cups are obtained by a cutting
operation from an intermediate product comprising a flat
base from which the hemispherical cups project in the
form of shaped pieces. Following the cutting operation,
preferably performed in the general plane of the base,
the hemispherical cups are separated from the base
itself which is usually discarded.
The method used to obtain the aforesaid intermediate
product usually comprises cooking in a mould, carried
out with two complementary mould parts (for example, of
cast iron) which define between them a space of
constant, or substantially constant, thickness both in
correspondence with the base and with the shaped parts.
The starting material is usually constituted by a
mixture based on water, flour or flours, sugar,
flavourings etc: the respective recipes, which may be varied according to specific requirements of use, are
widely known in the food industry and do not require
description here, particularly as they are not in
themselves relevant to an understanding of the
invention.
The mixture (wafer paste) in question is applied in such
a way that, when the two mould parts are closed, the
mixture itself occupies the aforesaid space. The mould
is then heated (the manner in which this is carried out
is also widely known in the art) until the wafer is
cooked to the desired degree. The subsequent opening of
the mould makes available the aforesaid intermediate
product from which the shaped wafers are cut .
Although fully satisfactory in relation to the problems
it was originally intended to solve (for example, for
the manufacture of pralines of the type described in EP-
A-0 064 155 or EP-A-0 086 319) , the solution described
above encounters a number of difficulties whenever it is
desired to produce thinner shaped wafers (for example,
having a thickness of 1-1.5 mm instead of a typical
thickness of approximately 2.5 mm in the case of the
pralines mentioned above) . This is found especially in
industrial applications, when high through-puts are
essential .
In the case of very thin wafers, the risk of the
intermediate product breaking on removal from the mould
increases and is, in fact, incompatible with the
reliability and yield required for an industrial
process .
The aim of the present invention is to modify the method
described in the prior art so as to make it possible to
manufacture wafers shaped, for example, as a basin and
which are very thin (approximately 1-1.5 mm or,
possibly, even thinner) .
According to the present invention, this aim is achieved
by a method having the characteristics claimed in Claim
1. Advantageous developments of the invention form the subjects of sub-claims 2 to 5. The invention also
concerns the related intermediate product having the
characteristics claimed in Claim 6 as well as the
corresponding wafer having the characteristics claimed
in Claim 7. The invention also concerns a mould for
carrying out the aforesaid method, having the
characteristics according to Claim 8. Advantageous
developments of this mould form the subjects of Claims 9
and 10.
The invention will now be described by way of non-
limitative example, with reference to the accompanying
drawings, in which:
Figure 1 shows schematically the intermediate wafer
product that can be obtained according to the invention;
Figure 2 shows the final product (the shaped wafer)
that can be obtained from the intermediate product of
Figure 1 ; and
Figure 3 shows in detail the mould for carrying out
the method according to the invention.
The intermediate product P shown in Figure 1 is
constituted essentially by a sheet (which, for the
purpose of the present invention, can be considered as
being of indefinite dimensions) of wafer including a
flat base part A in which are formed shaped parts C having, in this particular embodiment, a generally
elongate basin-like shape.
To give a better idea, one is dealing with the basin-
shaped half shells intended to form the wafer shell of
the food product described in Patent Application No.
PCT/EP96/00948 in the name of the same Applicant.
The wafer C (whose characteristics can be better
appreciated from Figure 2, where the wafer itself is
illustrated alone) is obtained from the intermediate
product P by means of a cutting operation schematically
illustrated at T m Figure 1 only The cutting
operation may be carried out in accordance with the
method described in one of the European Patent
Applications Nos. EP-A-0 054 229 or EP-A-0 221 033, that
is, by a cut effected parallel to the general plane of
the base layer A.
One essential characteristic can be appreciated from
Figure 1 and that is the fact that the intermediate
product P is not of uniform thickness but, on the
contrary, is thinner (1-1.5 mm or even less) in
correspondence with the shaped pares C, m comparison
with a significantly greater thickness (2.2-2.5 mm) m
the flat base part.
From this point of view, the solution according to the
invention differs from the known solutions (and, in
particular, from those adopted for praline manufacture
as described in European Patent Applications Nos. EP-A-0
064 155 or EP-A-0 086 319) , where an identical or
substantially identical thickness (for example, with a
wastage of 2.2 to 2.5 mm) is envisaged both for the base
part and the shaped part (in the form of a hemispherical
cup, in the embodiments described in the Patent
Applications referred to) .
The solution according to the invention is based on a
recognition of the fact that, on extraction from the
cooking mould, the greatest stresses in the intermediate
product P arise in the base part A rather than in the
shaped parts C.
For the time being, the Applicant is unable to provide
an explanation for the phenomenon observed: in effect,
the opposite would be expected, namely, that the more
considerable stresses would occur in the shaped parts C,
due to their intimate contact with the inside of the
corresponding, complementary shaped parts of the two mould parts .
The experiments conducted by the Applicant instead show
that the extraction of the intermediate product P from
the cooking mould (an operation often called
"demoulding") can occur without risk of breakage, even
of very thin shaped parts C, provided the base part A
has sufficient thickness (for example, approximately
2.2-2.5 mm) .
The provision of portions within the wafer sheet
constituting the intermediate product P with such
different thicknesses (the ratio between the thickness
of the base part A and that of the shaped parts C
exceeds 1.5 and is typically at least 1.6) assumes a
risk of non-uniform cooking and, hence, of non-uniform
characteristics in the sheet. It is, in fact, evident
that the thin parts generally tend to cook more than the
thick parts. However, the fact that the "useful" parts
(the shaped parts C) are the thinner parts, while the
"waste" parts (that is, the base part A) are the thicker
parts enables the characteristics and the cooking
conditions to be controlled to give the best results
desired for the useful parts without it being necessary
to worry excessively about a part which is usually
discarded. With the thickness ratios described above,
the experiments conducted by the Applicant demonstrate
that the base layer A has characteristics of firmness,
and hence of mechanical strength, such as to enable the
intermediate product P to be extracted easily and safely
from the cooking mould. Besides, the Applicant has been
able to check that, with the thicknesses indicated
above, even the base part A has acceptable organoleptic
characteristics so that it can be used in a production
cycle for food products.
Figure 3 shows schematically a cooking mould usable for
the manufacture (according to widely known criteria, as
has been said) of the intermediate product P of Figure
In practice, the two complementary male and female mould
parts, indicated 2 and 3 respectively, have structures
which reproduce complementarily (thus, positively in the
case of the half-mould 2, and negatively in the case of
the half-mould 3) the shape of the intermediate product
P.
In both of the elements 2 and 3, respective base parts
4, 5 and respective shaped parts 6, 7 can be
distinguished.
An important characteristic of the mould in question is
that the conformation of the two mould parts 2, 3 and/or
the characteristics of the associated spacer elements 8
(these too are usually formed as male and female
elements intended to engage each other when the mould 2
and the counter-mould 3 are coupled together) are chosen
so as to ensure that there is a space of constant
thickness, for example, approximately 2.2-2.5 mm,
between the base parts 4, 5 of the two coupled mould
parts 2, 3, while the shaped parts 6, 7 are separated by
a space which is shaped like the shape of the parts C
and has a constant thickness of approximately 1-1.5 mm
(or even less, depending on requirements) .
Preferably, one or both of the mould parts 2, 3 are
embossed or finished (as known per se) with a square or
rhombus motif (so-called "waffle") over their entire
surfaces .
Naturally, the principle of the invention remaining the
same, the details of manufacture and the embodiments may
be widely varied with respect to that described and
illustrated, without thereby departing from the scope of
the present invention.
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