METHOD FOR MANUFACTURING SHIELDED PRINTED WIRING BOARD AND SHIELDED PRINTED WIRING BOARD

WIPO Patent Application WO/2020/122071

A1

This manufacturing method for shielded printed wiring boards is characterized by including: a step in which a printed wiring board is prepared; a step in which first and second electromagnetic wave shielding films are prepared that have a protective film, an insulating layer, and an adhesive layer positioned in order; a step in which the first and second electromagnetic wave shielding films are arranged on the printed wiring board such that the adhesive layer is in contact with both surfaces of the printed wiring board, then part of the adhesive layer is positioned further on the outside than an end of the printed wiring board and first and second extended ends are created; a step in which the first extended end and the second extended end are overlapped such that a gap is created in a section between the first extended end and the second extended end, the printed wiring board is pressurized and heated so that the adhesive layer does not completely cure, and a temporarily pressed shielded printed wiring board is created; a step in which the protective film is removed from the temporarily pressed shielded printed wiring board and a pre-main-press shielded printed wiring board is created; and a step in which the pre-main-press shielded printed wiring board is pressurized and heated and the adhesive layer is cured.

YAMAUCHI SIROU (JP)
TAJIMA HIROSHI (JP)
HARUNA YUUSUKE (JP)
KATSUKI TAKAHIKO (JP)

PCT/JP2019/048304

June 18, 2020

December 10, 2019

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TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)

H05K9/00; H05K1/02

JPH08125380A	1996-05-17
JP2017147448A	2017-08-24
JP2018041953A	2018-03-15
JP2006013076A	2006-01-12
JP2004095566A	2004-03-25

YASUTOMI & ASSOCIATES (JP)

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