Title:
METHOD FOR MANUFACTURING SILICON PIECE FOR MANUFACTURE OF SILICON INGOT
Document Type and Number:
WIPO Patent Application WO/2010/010903
Kind Code:
A1
Abstract:
A silicon piece having excellent handleability and safeness can be manufactured by implementing a method including the following steps: a step of preparing a pressurizing forming apparatus (10), which includes a cylindrical body (11), and an upper component (12) and a lower component (13) at least one of which is vertically slidable inside the cylindrical body, and at least one of which is composed of a liquid-permeable filter; a step of storing, inside the cylindrical body between the upper component and the lower component, a slurry (23) wherein a silicon powder (21) is dispersed in an aqueous solvent (22); a step of obtaining a columnar or board-like compact containing 40 mass% of solvent or less, by pressurizing the slurry, while bringing at least one of the upper component and the lower component close to the other component, and removing the solvent by making the solvent permeate the filter; a step of taking out the compact from the pressurizing forming apparatus; and a step of obtaining a silicon piece by removing the solvent in the compact by evaporation by heating the compact.
Inventors:
OHNISHI, Kazumasa (121-35, Hanazonohigashi 2-chome Nagaoka-sh, Niigata 46, 〒9400846, JP)
Application Number:
JP2009/063125
Publication Date:
January 28, 2010
Filing Date:
July 22, 2009
Export Citation:
Assignee:
OHNISHI, Kazumasa (121-35, Hanazonohigashi 2-chome Nagaoka-sh, Niigata 46, 〒9400846, JP)
International Classes:
C01B33/02; B01D33/00; B30B9/06; B30B9/28
Attorney, Agent or Firm:
YANAGAWA, Yasuo et al. (Mitsuya-Yotsuya Building 8th Floor, 2-14 Yotsuya, Shinjuku-k, Tokyo 04, 〒1600004, JP)