METHOD FOR MANUFACTURING SILICON SUBSTRATE HAVING GLASS EMBEDDED THEREIN

WIPO Patent Application WO/2011/118788

A1

Disclosed is a method for manufacturing a silicon substrate having a glass embedded therein, wherein a step generated on the polishing surface due to the difference between the polishing rate of silicon and that of the glass is suppressed. The method has: a first step wherein a protruding section having a first metal film at the top portion is formed on the first main surface of the silicon substrate having the first and the second main surfaces that face each other; a second step wherein the third main surface of the glass substrate having the third and the fourth main surfaces that face each other is overlaid on the first main surface of the silicon substrate; a third step wherein the glass substrate is softened by applying heat, and a part of the glass substrate is embedded in the periphery of the protruding section of the silicon substrate; a fourth step wherein the glass substrate is cooled; and a fifth step wherein the fourth main surface of the glass substrate is uniformly ground off until the first metal film is exposed from the fourth main surface of the glass substrate. In the fifth step, at least mechanical polishing with chemical effects using an abrasive or a polishing liquid is performed.

OKUMURA SHIN (JP)
NAKATANI TOMOHIRO (JP)
TAURA TAKUMI (JP)
TOMOIDA RYO (JP)

PCT/JP2011/057403

September 29, 2011

March 25, 2011

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PANASONIC ELEC WORKS CO LTD (JP)
OKUMURA SHIN (JP)
NAKATANI TOMOHIRO (JP)
TAURA TAKUMI (JP)
TOMOIDA RYO (JP)

H01L23/15; B24B37/04; G01P15/08; G01P15/125; H01L23/14; H01L29/84

JP2002043468A	2002-02-08
JP2006047279A	2006-02-16

TANAKA, Mitsuo et al. (JP)
Mitsuo Tanaka (JP)

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