Title:
METHOD FOR MANUFACTURING SOLDER ELECTRODE AND INTENDED USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/181859
Kind Code:
A1
Abstract:
The present invention is a method for manufacturing a solder electrode, the method comprising a step (1) in which a coating film of a light-sensitive resin composition is formed on a substrate that has an electrode pad, a step (2) in which the coating film is selectively exposed and developed to form a resist having an opening section in a region corresponding to the electrode pad, and a step (3) in which the opening section is filled with molten solder, wherein the light-sensitive resin composition contains at least a benzoxazole precursor. This method for manufacturing a solder electrode makes it possible to prevent cracking on the resist surface even if the resist is subjected to high heat during solder filling and to improve solder filling performance, and as a result thereof, a solder electrode that is suited to the purpose thereof can be appropriately manufactured.
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Inventors:
MUKAWA JUN (JP)
TAKAHASHI SEIICHIROU (JP)
HASEGAWA KOUICHI (JP)
KUSUMOTO SHIROU (JP)
YAMAGUCHI YOSHIKAZU (JP)
TAKAHASHI SEIICHIROU (JP)
HASEGAWA KOUICHI (JP)
KUSUMOTO SHIROU (JP)
YAMAGUCHI YOSHIKAZU (JP)
Application Number:
PCT/JP2016/063365
Publication Date:
November 17, 2016
Filing Date:
April 28, 2016
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
H01L21/60; G03F7/023; G03F7/40; H05K3/34
Foreign References:
| JP2002203869A | 2002-07-19 | |||
| JP2012086531A | 2012-05-10 | |||
| JP2006056939A | 2006-03-02 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
Patent business corporation SSINPAT (JP)
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