Title:
METHOD FOR MANUFACTURING STACKED ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2007/105395
Kind Code:
A1
Abstract:
This invention provides a method for manufacturing a stacked electronic component
which has an excellent effective volume ratio and is highly reliable. In the manufacturing
method, a laminate in its predetermined face at its sites where each end of a plurality
of internal electrodes is exposed, is directly subjected to electroless plating
to form a thin and highly dense external electrode. In carrying out the step of
electroless plating for external electrode (8, 9) formation, a plating solution
containing a reducing agent and a metal ion having a deposition potential which
is electrochemically more noble than the redox potential of the reducing agent
is provided. A laminate (5) for stacked electronic components, together with
electroconductive media having catalytic activity against an oxidation reaction
of the reducing agent, is placed in a vessel, followed by stirring of the laminate
(5) and the electroconductive media in the plating solution by rotation, swinging,
slanting, or vibration. In this case, electroless plating proceeds so that plating
deposits (12a, 12b) deposited on the end of a plurality of internal electrodes
(3a, 3b) are connected to each other.
Inventors:
KUNISHI, Tatsuo (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 6178555, JP)
国司 多通夫 (〒55 京都府長岡京市東神足１丁目１０番１号 株式会社村田製作所内 Kyoto, 6178555, JP)
OGAWA, Makoto (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 6178555, JP)
国司 多通夫 (〒55 京都府長岡京市東神足１丁目１０番１号 株式会社村田製作所内 Kyoto, 6178555, JP)
OGAWA, Makoto (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 6178555, JP)
Application Number:
JP2007/052455
Publication Date:
September 20, 2007
Filing Date:
February 13, 2007
Export Citation:
Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 6178555, JP)
KUNISHI, Tatsuo (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 6178555, JP)
国司 多通夫 (〒55 京都府長岡京市東神足１丁目１０番１号 株式会社村田製作所内 Kyoto, 6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足１丁目１０番１号 Kyoto, 6178555, JP)
KUNISHI, Tatsuo (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 6178555, JP)
国司 多通夫 (〒55 京都府長岡京市東神足１丁目１０番１号 株式会社村田製作所内 Kyoto, 6178555, JP)
International Classes:
H01G4/30; H01G4/12; H01G13/00; H01G4/30; H01G4/12; H01G13/00
Attorney, Agent or Firm:
KOSHIBA, Masaaki (Koshiba Patent Office, Nisshin Buiding 14-22, Shitennoji 1-chome, Tennoji-ku, Osaka-sh, Osaka 51, 5430051, JP)
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