Title:
METHOD FOR MANUFACTURING STACKED-TYPE ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/016386
Kind Code:
A1
Abstract:
[Problem] To provide a method for manufacturing a stacked-type electronic component in which a stacked body formed by stacking a functional portion and an electrical conductor portion has extremely high forming accuracy.
[Solution] A method for manufacturing a stacked-type electronic component comprising an element body in which a functional portion and an electrical conductor portion are stacked comprises: a first step of, using an ejection device in which ink in an ejection unit is charged by a voltage application means and which ejects the charged ink from the ejection unit by electrostatic suction force, forming a green functional portion 12 using a first ink as the ink including functional particles; a second step of forming a green electrical conductor portion 13 using a second ink as the ink including electrical conductor particles; a step of forming a green stacked body by repeating the first step and the second step; and a step of obtaining an element body by processing the green stacked body.
Inventors:
SATO JUN (JP)
WADA YUKARI (JP)
WADA YUKARI (JP)
Application Number:
PCT/JP2017/025270
Publication Date:
January 25, 2018
Filing Date:
July 11, 2017
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/12; H01G4/30; H01G13/00
Foreign References:
| JP2002170750A | 2002-06-14 | |||
| JP2005067046A | 2005-03-17 | |||
| JP2006298961A | 2006-11-02 |
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
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