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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN MAGNETIC BODY, AND MAGNETIC RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/204209
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of providing a method for manufacturing a substrate with a built-in magnetic body, the method making it less likely for magnetic material residue to remain on the substrate surface, thereby eliminating or simplifying a polishing step. A method for manufacturing a substrate with built-in magnetic body (1) according to the present disclosure comprises a preparation step, a filling step, and a peeling step. In the preparation step, a surface-protected substrate (5) and a magnetic material (6) are prepared. The surface-protected substrate (5) comprises: a substrate (2); a protective sheet (3) which is disposed on a surface of the substrate (2) and which includes a sheet body (7); and through holes (4) that penetrate the substrate (2) and the protective sheet (3). In the filling step, the magnetic material (6) is packed into the through holes (4) from the protective sheet (3) side. In the peeling step, the sheet body (7) is peeled from the substrate (2).

Inventors:
UEMURA TOMOHITO
SASAKI DAISUKE
NAGATSUKA RYO
Application Number:
PCT/JP2023/015463
Publication Date:
October 26, 2023
Filing Date:
April 18, 2023
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K3/46; H01F1/26
Foreign References:
JP2001036214A2001-02-09
JP2001237586A2001-08-31
JP2021061264A2021-04-15
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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