METHOD FOR MANUFACTURING SUBSTRATE WITH INTEGRATED RADIATOR, AND SUBSTRATE WITH INTEGRATED RADIATOR

Title:

METHOD FOR MANUFACTURING SUBSTRATE WITH INTEGRATED RADIATOR, AND SUBSTRATE WITH INTEGRATED RADIATOR

Document Type and Number:

WIPO Patent Application WO/2013/141110

Kind Code:

A1

Abstract:

A metal circuit board (15) and a metal base plate (20) are bonded to a ceramic substrate (10) in order to form a metal-ceramic bonded substrate (2). Then, the metal base plate (20) is placed on top of one surface of a radiator (30) via a brazing filler material (33), a jig (51) that has a concave rounded surface (55) is butted against the other surface of the radiator (30), a jig (52) that has a convex rounded surface (56) protruding toward the metal-ceramic bonded substrate is brought into contact with the other surface of the metal circuit board (15), and the metal-ceramic bonded substrate (2) and the radiator (30) are thermally bonded together while applying a pressure by means of the radiator-side jig (51) and the metal-ceramic bonded substrate-side jig (52). The curvature radii (R (mm)) of the convex rounded surface (56) and the concave rounded surface (55) are expressed as 6,500 ≤ R ≤ surface pressure (N/mm2) × 2,000 + 12,000.

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Inventors:

HORI HISASHI (JP)
KOKUBO TAKANORI (JP)
OSANAI HIDEYO (JP)
CHIHARA KUNIHIKO (JP)

Application Number:

PCT/JP2013/057025

Publication Date:

September 26, 2013

Filing Date:

March 13, 2013

Export Citation:

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Assignee:

NIPPON LIGHT METAL CO (JP)
DOWA METALTECH CO LTD (JP)

International Classes:

H05K7/20; H01L23/36

Domestic Patent References:

WO2011087027A1

2011-07-21

Foreign References:

JP2008227336A	2008-09-25
JP2010272770A	2010-12-02
JP2006140403A	2006-06-01
JP2011216533A	2011-10-27
JP2000335983A	2000-12-05
JP2011166127A	2011-08-25
JP2011210745A	2011-10-20

Other References: