Title:
METHOD FOR MANUFACTURING A SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2010/140335
Kind Code:
A1
Abstract:
Metal columns formed from bumps and press fitted into an insulating resin layer, easily and inexpensively interconnect metal foils that are contact bonded to a thermosetting insulating resin layer or interconnect the electrodes of electric components built into the thermosetting insulating resin layer and the metal foil are contact bonded to the insulating resin layer. Thus, the electrical connection reliability of the aforementioned metal columns drastically improves when manufacturing a substrate. Bumps (2) of a conductive paste (3) containing metal fillers (4) are formed on a metal foil (1) that is contact bonded to an insulating resin layer (6). The bumps (2) are heated in order for the metal fillers (4) to melt and bond and the bumps (2) and the metal foil (1) form a metallic bond in order to integrally connect the metal columns (5). The metal columns (5) are press fitted into the insulating resin layer (6) while the metal foil (1) is contact bonded to the insulating resin layer (6). Meanwhile, the tip of the metal columns (5) are welded onto the metal foil (7) after which the metal columns (5) are re-heated so as to form a metallic bond with the metal foil (7) and thereby integrally connecting the metal columns (5) with the metal foil (7).
Inventors:
SEKIMOTO HIROYUKI (JP)
Application Number:
PCT/JP2010/003627
Publication Date:
December 09, 2010
Filing Date:
May 31, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
SEKIMOTO HIROYUKI (JP)
SEKIMOTO HIROYUKI (JP)
International Classes:
H05K3/40; H05K3/46
Domestic Patent References:
| WO2009028239A1 | 2009-03-05 |
Foreign References:
| JP2002246753A | 2002-08-30 | |||
| JPH0774466A | 1995-03-17 | |||
| JPH1131715A | 1999-02-02 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
Yuji Yanase (JP)
Yuji Yanase (JP)
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