Title:
METHOD FOR MANUFACTURING SUPPORTING SUBSTRATE FOR SEMICONDUCTOR LIGHT-EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/262957
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing a supporting substrate for a semiconductor light-emitting device, the method comprising the steps of: preparing a substrate in which a groove is formed; inserting, into the groove of the substrate, a material for forming a passage functioning as a thermal passage and/or an electrical passage; and pressurizing the material from both ends of the groove through a pressurizing means.
Inventors:
AN SANG JEONG (KR)
Application Number:
PCT/KR2020/008226
Publication Date:
December 30, 2020
Filing Date:
June 24, 2020
Export Citation:
Assignee:
AN SANG JEONG (KR)
International Classes:
H01L33/00; H01L33/20; H01L33/38; H01L33/62
Foreign References:
| KR20170124766A | 2017-11-13 | |||
| JP2009532912A | 2009-09-10 | |||
| US6213386B1 | 2001-04-10 | |||
| JP2013062474A | 2013-04-04 | |||
| KR20110081813A | 2011-07-14 |
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