Title:
METHOD OF MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2002/001714
Kind Code:
A1
Abstract:
A surface acoustic wave device to be used as a branching filter for handling high-frequency waves of several GHz in a mobile communication field can be manufactured by forming a metal film over a wafer-shaped piezoelectric substrate and by removing the metal film selectively to form comb-shaped metal electrodes. The metal film is formed at its partial portion in two or more filming modes having different distributions of filming rates in the wafer plane and at the remaining portion in a predetermined filming mode. The film thickness distribution of the metal film in the wafer plane can be controlled highly precisely. By filming the remaining portion of the metal film, the final thickness of the metal film can be controlled highly precisely.
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Inventors:
TAKAGI TOSHIYUKI (JP)
Application Number:
PCT/JP2001/004814
Publication Date:
January 03, 2002
Filing Date:
June 07, 2001
Export Citation:
Assignee:
TOSHIBA KK (JP)
TAKAGI TOSHIYUKI (JP)
TAKAGI TOSHIYUKI (JP)
International Classes:
H03H3/08; (IPC1-7): H03H3/08; C23C14/35; H03H9/145
Foreign References:
| JPH03208888A | 1991-09-12 |
Other References:
See also references of EP 1306972A4
Attorney, Agent or Firm:
Miyoshi, Hidekazu (2-8 Toranomon 1-chome, Minato-k, Tokyo 01, JP)
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