METHOD FOR MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE AND SURFACE ACOUSTIC WAVE DEVICE

WIPO Patent Application WO/2007/080734

A1

Disclosed is a low-cost miniaturizable surface acoustic wave device which does not require a complicated processing process or a component such as a cover member having a complicated shape. Also disclosed is a method for manufacturing such a surface acoustic wave device. Specifically disclosed is a method for manufacturing a surface acoustic wave filter device (1), which comprises a step for forming grooves (2b, 2c) in one major surface (2a) of a piezoelectric substrate (2), a step for forming an IDT electrode by filling the groove (2b) with a metal film, a following step wherein a part of the piezoelectric substrate (2) is removed from the one major surface (2a) of the piezoelectric substrate (2), thereby forming a recess (2d) having a bottom surface wherein the IDT electrode is embedded, and a succeeding step for joining a cover member (13) to the piezoelectric substrate (2).

JP4370615	Piezoelectric device and its manufacturing method
WO/2012/127979	MANUFACTURING METHOD FOR ELECTRONIC COMPONENT MODULE AND ELECTRONIC COMPONENT MODULE
JPS5441690	ELASTIC SURFACE WAVE UNIT

KADOTA MICHIO (JP)
KIMURA TETSUYA (JP)

PCT/JP2006/324752

July 19, 2007

December 12, 2006

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MURATA MANUFACTURING CO (JP)
KADOTA MICHIO (JP)
KIMURA TETSUYA (JP)

H03H3/08; H01L41/09; H01L41/18; H03H9/25

JPH10163797A	1998-06-19
JPH0983030A	1997-03-28
JPH07115343A	1995-05-02
JPH0645866A	1994-02-18
JP2001345673A	2001-12-14
JPH10163797A	1998-06-19
JPS5664509A	1981-06-01
JPH07115343A	1995-05-02

See also references of EP 1973228A4
WILLIAM J. TANSKI: "A Configuration and Circuit Analysis for One-Port SAW Resonators", ENGINEERING INFORMATION INC.

MIYAZAKI, Chikara (5-4 Tanimachi 1-chome, Chuo-ku, Osaka-sh, Osaka 12, JP)

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